As electronic devices continue to shrink in size while demanding higher performance, component density on PCBs has reached unprecedented levels. Connectors, being essential components in electronic systems, require both miniaturization and enhanced reliability. The Preci-Dip 1.27mm pitch header emerges as an optimal solution for these high-density interconnect needs, offering compact design, superior electrical performance, and reliable mechanical characteristics.
The Preci-Dip 1.27mm pitch header features a pin spacing that's half that of traditional 2.54mm connectors, enabling significantly higher pin density within the same PCB area. This design allows engineers to maximize interconnections in constrained spaces while reducing device size and improving integration. The product line includes single-row, dual-row, and triple-row configurations to accommodate diverse application requirements:
Beyond its space-saving design, the 1.27mm pitch header demonstrates outstanding electrical and mechanical properties. The connectors utilize high-temperature thermoplastic insulation capable of withstanding both wave soldering and reflow processes. Key specifications include:
The connectors meet UL 94V-0 flammability requirements, ensuring self-extinguishing properties to mitigate fire risks. Additionally, they comply with RoHS environmental directives, eliminating hazardous substances from their construction.
Preci-Dip employs black glass-filled polyester insulation that combines high-temperature resistance with mechanical strength and dimensional stability. Contact pins feature either gold or tin plating to enhance conductivity and corrosion resistance, ensuring reliable signal transmission.
The 1.27mm pitch headers serve multiple sectors where space efficiency and reliability are paramount:
Preci-Dip distinguishes itself through several key attributes:
As electronic devices continue trending toward miniaturization and higher performance, interconnect solutions like the Preci-Dip 1.27mm pitch header will remain critical components enabling technological advancement across industries.